14th International Conference and Exhibition on Device Packaging
March 06 - March 08, 2018
10438 N Fort McDowell Rd, Fort McDowell, AZ 85264, USA
The 14th Annual Device Packaging Conference (DPC 2017) will be held in Fountain Hills, Arizona, on March 5-8, 2018. It is an international event organized by the International Microelectronics Assembly and Packaging Society (IMAPS).
The conference is a major forum for the exchange of knowledge and provides numerous technical, social and networking opportunities for meeting leading experts in these fields. The conference will attract a diverse group of people within industry and academia. It provides a chance for educational interactions across many different functional groups and experience levels. People who will benefit from this conference include: scientists, process engineers, product engineers, manufacturing engineers, professors, students, business managers, and sales & marketing professionals.
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