Purging compound for multi-layer extrusions
Canadian Plastics
Dyna-Purge SF from Shuman Plastics has an extended temperature range (320F to 575F) to permit purging of a variety of resins being processed concurrently, a situation that mayoccur in multi-layer, m...
Dyna-Purge SF from Shuman Plastics has an extended temperature range (320F to 575F) to permit purging of a variety of resins being processed concurrently, a situation that mayoccur in multi-layer, multi-resin sheet and film extrusion lines.
The purging compound has a proprietary, non-chemical active ingredient that improves cleaning power, says Shuman Plastics. When subjected to heat from the process, the compound expands and foams to reach all the gaps in the processing system.
Shuman Plastics Inc.
716/852-4410
