CardXX RAMPs up roster of embedded electronic gadgets
Canadian Plastics
Anyone who has ever been unable find a car in a crowded parking lot knows the value of a good key fob to activate the car's alarm....
Anyone who has ever been unable find a car in a crowded parking lot knows the value of a good key fob to activate the car’s alarm.
To help these forgetful folks, CardXX of Englewood, Colo., is developing products like key fobs with integrated electronic components such as radio frequency computer chips.
However, it has dispensed with a traditional layering manufacturing process and opted for a reaction-assisted molding process (RAMP) and polyurethane (PU) dispensing equipment from Lakewood, N.J.-based Gusmer/Decker to integrate these radio frequency computer chips and other electronic components into key fobs, memory tags and other portable electronic devices, like Smart Cards.
The RAMP technique precisely positions the computer chips within a mold between two sheets of PVS or polycarbonate film. A PU mixture is then injected at a low temperature and a low pressure to completely immerse the electronic element, and completely protect it when the product cures.
“Smart cards (and other electronic items) have very precise dimensional requirements,” Dr. Paul Reed, director of business development for CardXX, said. “Delivering the correct quantity of polymer to the mold is absolutely critical for meeting the rigorous form factor requirements and achieving proper protective encapsulation of the very delicate electronics.”
Plus, RAMP’s ability to provide low-temperature delivery enables high production volumes because of minimized cycle time, he added.
Gusmer/Decker; www.gusman-decker.com; 800-370-9000
