Materials (September 01, 2007)

Polymer blend for semiconductor/electronics applications

Victrex has introduced a new Victrex T-Series compound called TF-60C, a proprietary blend of Victrex Peek polymer, celazole polybenzimidazole (PBI) and carbon fibre reinforcement suited for semiconductor/electronics applications such as soldering tools, cassettes, wafer transportation and chamber parts in spin coating, etching and PVD.

TF-60C delivers high strength, high modulus and low creep, as well as mechanical performance at high temperatures up to 300C (572F).

Other features include excellent tribology and resistance to a range of extreme environments.

Additionally, TF-60C requires no secondary processing, and can be recycled to improve molding yields.

Victrex (West Conshohocken, Pa.);

www.victrex.com; 1-800-842-8739

New epoxy resin for processing operations

Master Bond Inc.’s new highly flexible, two component epoxy resin compound EP40 features outstanding shear and peel strength, and is especially designed for bonding, sealing and casting engineering plastics and metals.

EP40 provides a solution for applications requiring strength properties of epoxy resins with enhanced flexibility and peel strength characteristics. Additional performance characteristics include superior resistance to thermal cycling and mechanical vibration and shock.

Electrical insulation properties are excellent, even after prolonged exposure to hostile environmental conditions. Shear and peel strength for bonding polycarbonates are 1000 psi and 20 pli respectively, and EP40 has a wide service temperature range of -100 F to 230 F.

Master Bond Inc. (Hackensack, N.J.);

www.masterbond.com; 201-343-8983