Canada’s Barry Shepherd is SPE Thermoformer of the Year
March 4, 2015 by Canadian Plastics
Throughout the 1960s, Shepherd worked for several different packaging companies in sample making and design. He joined Kodak Canada in 1970 and began designing packaging for cameras, film, and related products. While at Kodak he was involved in the development of packaging for Kodachrome slides, an early ground-breaking use of thin-wall injection molding.
During the mid 70s and early 80s, Shepherd worked for several corrugated packaging companies in positions ranging from sales to president of a small box company. “He always stayed involved in his passion: design and development,” SPE said. “In 1984, [he] was introduced to the Alloyd Company, which specialized in thermoforming medical, consumer packaging, and sealing equipment, and he was intrigued by plastics and blister packaging.”
The next year, Shepherd launched Shepherd Packaging, selling plastic blisters, trays, clamshells, sealing equipment, and other packaging materials. “Shepherd Packaging expanded its manufacturing business and in 1997 entered the heavy gauge thermoforming market by developing a custom thermoformed plastic pallet for Lear,” SPE said. “Under Shepherd’s leadership in 2006, Shepherd Packaging opened its 43,000-square-foot custom thermoforming facility near Toronto, where the company operates seven thermoforming and two CNC milling machines.” Now retired, Shepherd remains active on the Shepherd Packaging Board of Advisors.
Shepherd’s involvement with the SPE stretches back to 1997, when he joined the SPE Thermoforming Division Board of Directors and also worked on several SPE committees, including the Executive Committee, before retiring from the Board in 2010. During his tenure, Shepherd also served as technical editor of the Thermoforming Division’s award-winning publication, SPE Thermoforming Quarterly magazine.
The award will be presented on September 1 in Atlanta, Ga., during SPE’s Thermoforming Awards Dinner, held in conjunction with the 24th SPE Thermoforming Conference.