Canadian Plastics

Filled polypropylene helps wind-up computer chips

A leading electronics manufacturer is benefiting from the use of a spool that is injection molded from calcium-filled polypropylene from the Plastics Group of America. The spool, molded by Phoenix Cus...

May 1, 2000   Canadian Plastics



A leading electronics manufacturer is benefiting from the use of a spool that is injection molded from calcium-filled polypropylene from the Plastics Group of America. The spool, molded by Phoenix Custom Molders in Wolfeboro, NH, is used to wind delicate personal computer chips. The chips are attached to a wire that is wound and stored on the spool for shipment.

Weighing over eight pounds and measuring 27 in. in diameter, the spool needs to pass stringent tests for impact strength. “Our customer requires a spool that can withstand a fall to the floor without cracking,” said Mark Merrow, plant manager at Phoenix. “The computer chips are valuable cargo.”

After experimenting with several materials, Phoenix called The Plastics Group for their recommendations. Says Merrow: “We tried their calcium-filled polypropylene and it worked great. We now use their RMC-40 Polifil material exclusively for this project.”

An additional benefit of using the resin was the cost savings, according to Craig Dwyer, account manager at the Plastics Group. “This application was another example of how filled polypropylene, when compounded correctly, can do the same or better job than much more expensive engineering resins,” he said.

The Plastics Group 401/767-2700


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