ISTA’s Forum brings together the packaging community through two co-located events, TransPack and TempPack. TransPack provides a balance of valuable presentations, case studies, research and solutions from world-leading experts surrounding the optimization of packaging for transport. TempPack focuses on technical topics related to global temperature controlled performance packaging. The TempPack Forum creates an opportunity for presenters to share their insights, challenges, case studies and research having a direct impact on the industry. Both programs are designed to create opportunities for you to network with like-minded professionals who are facing the same challenges in all different sectors and verticals. You can expect to build new relationships and create resources with people centered on the transport packaging industry.