The 8th edition of AMI’s international Thin Wall Packaging conference will take place on June 18-19, 2019 at The Westin Chicago North Shore, Chicago, IL, USA
Located in the heart of the packaging industry, attendees will participate in second-to-none networking and experience a compelling conference program. The two-day event will cover functionality of plastics materials in protecting and preserving items such as meat, fish, yogurt, fruit and vegetables, dairy and ready meals. It will discuss new applications, technology developments, improved decoration and automation.
Thin Wall Packaging 2018 offers a unique networking opportunity for leading food companies, retailers, packaging manufacturers, researchers, and suppliers of the industry to debate the latest developments and market trends in light weight plastics packaging. It is also a great platform to have a full overview of the available technology, product and services thanks to the busy exhibition area.