Thin Wall Packaging 2015
May 06 - May 07, 2015
The Westin Chicago North Shore, 601 N Milwaukee Ave, Wheeling, IL 60090, United States
AMI’s Thin Wall Packaging 2015 will take place on May 6-7, 2015 at The Westin Chicago North Shore in Chicago, IL, USA. Thin Wall Packaging 2015 offers a unique networking opportunity for leading food companies, retailers, packaging manufacturers, researchers, and suppliers of the industry to debate the latest developments and market trends in lightweight plastics packaging.
Thin Wall Packaging like tubs, cups, pots, trays, clamshells and plastic jars, provides a means of supplying consumer appeal, convenience and product protection, whilst reducing the carbon footprint. Barrier properties can be tailored to the application by careful material selection to be cost-effective. Innovative designs are enabled by developments in manufacturing technology. Applications include margarine, yogurt, ice cream, meat, bakery, fresh fruit and vegetables. TV dinners are a rapidly growing market as households work harder: microwave, freezer and oven-proof containers are included in this sector.
Thin Wall Packaging 2015 will provide lively interaction and debate between the speakers and delegates, and gives a comprehensive overview of the latest materials, technology and market trends in lightweight packaging.
We are currently recruiting speakers. If you would like to be considered for our program please email or fax a title, brief summary and speaker details to Amanda Schaeffer at firstname.lastname@example.org.
For further information on this conference please contact Amanda Schaeffer, Conference Coordinator at email@example.com or call +1 610 478 0800.
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